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The HBM Stacking Robots — TC Bonders & Hybrid Bonders · The Memory Wall — HBM, DRAM, NAND & the AI Memory Cartel

042700.KS

Hanmi Semiconductor
Foreign listing — not directly tradable in a US brokerage. Editorial detail only.

71% global share of TC bonders — the machine that physically stacks every HBM die on Earth.

What they do

Korean equipment maker that builds the thermo-compression (TC) bonders that stack HBM DRAM dies layer-by-layer with sub-micron alignment . Per TechInsights' 2025 TC Bonder Market Report, Hanmi holds 71.2% global share (cumulative $247.7M). Over 90% share specifically in HBM3E 12-layer TC bonders. Closest competitors: SEMES (Samsung's in-house, 13.1%), ASMPT (5.6%), Yamaha Robotics (5.6%). They are now expanding into hybrid bonding too.