LPKFF

What they do

German company specializing in the laser systems used to drill holes through glass substrates — the next-generation replacement for the organic substrates in today's AI chip packages. Glass substrates promise better thermal performance and tighter chip stacking. Intel, TSMC, and other foundries are all moving toward glass for next-gen packaging. Called out by @aleabitoreddit before its run. Small-cap European, illiquid for U.S. retail.